Do you know the packaging process of LED chip beads?

For people engaged in the LED chip bead industry, it is necessary to understand the packaging process of LED chip beads. So, what is the packaging process of LED chip beads?

 

When packaging LED SMT beads, we should first select the appropriate size, luminous rate, color, voltage, and current of the LED bead packaging chip. The following is a description of the points:

 

1. Expanding crystal, using an expansion machine to evenly expand the entire LED chip film provided by the manufacturer, so that the tightly arranged LED grains attached to the film surface are pulled apart, making it easy to prick crystals.

 

2. Back glue, place the expanded crystal ring on the surface of the back glue machine that has already scraped the silver paste layer, and apply the silver paste on the back. Point the silver paste. Suitable for bulk LED chips. Use a dispensing machine to apply an appropriate amount of silver paste onto the PCB printed circuit board.

 

3. Solid crystal, place the prepared silver paste expansion ring into the crystal rack, and the operator will use a crystal pen to prick the LED chip onto the PCB printed circuit board under a microscope.

 

4. Fixed crystal, place the PCB printed circuit board with the punctured crystal into a thermal cycling oven and let it stand for a period of time at a constant temperature. After the silver slurry solidifies, remove it (do not leave it for a long time, otherwise the LED chip coating will turn yellow and oxidize, causing difficulties for bonding). If there is LED chip bonding, the above steps are required; If only the IC chip is bound, cancel the above steps.

 

5. Welding wire, using an aluminum wire welding machine to bridge the chip with the corresponding solder pad aluminum wire on the PCB board, that is, to weld the inner lead of the COB.

 

6. During the initial testing, use specialized testing tools (with different equipment for different purposes of COB, such as high-precision regulated power supply) to test the COB board, and repair the unqualified board again.

 

7. Dispensing, a dispensing machine is used to apply an appropriate amount of AB glue to the LED grains prepared by bonding, and the IC is packaged with black glue, followed by appearance packaging according to customer requirements.

 

8. Curing, place the sealed PCB printed circuit board or lamp holder in a thermal cycling oven and let it stand at a constant temperature. Different drying times can be set according to requirements.

 

9. Overall testing, use specialized testing tools to test the electrical performance of the packaged PCB printed circuit board or lamp rack, and distinguish between good and bad.

 

10. Divide light, use a splitter to distinguish the brightness of lights with different intensities according to requirements, and package them separately.

 

11. After entering the warehouse, we will go out in bulk to create a comfortable LED bead packaging energy-saving life for everyone.